3Dresyn IM-HT-WS Hard Tough Water-Soluble Sacrificial Resin

3Dresyn® IM-HT-WS is a water-soluble sacrificial mold-making photopolymer developed for the fabrication of injection molds intended for low and medium injection temperature materials, including plastics, silicones and waxes.

Designed for use in vat photopolymerization systems (SLA, DLP and LCD) within controlled professional environments. Suitable for the fabrication of water-soluble sacrificial injection molds requiring balanced rigidity, dimensional stability and fast dissolution performance.

• Water-soluble sacrificial injection molds
• Molds for low and medium temperature plastic injection
• Molds for silicone and wax injection processes
• Thin-wall sacrificial molds requiring high resolution and controlled solubility
• Auxiliary tooling for low-temperature molding workflows

• Young’s modulus: >2000 MPa (ISO 527)
• Elongation: <4% (ISO 527)
• Shore hardness: D80 (ISO 868)
• Tensile and flexural strength: <40 MPa (ISO 527 / ISO 178)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Viscosity: <100 mPas at 23°C ± 2°C (ISO 3219)
  

• Heat deflection temperature (HDT): <100 °C @ 0.45 MPa (ISO 75)

• Fast solubility in water
• Tack-free finishes after light box post-curing
• High rigidity to permit printing of thin rigid mold walls for maximum solubility speed and minimum resin consumption
• Non-brittle at injection temperatures
• High resolution once tuned to printer specifications and after full workflow implementation
• Very low shrinkage

• Printable with most commercial and professional SLA, DLP and LCD 3D printers
• Cyan version is recommended for increased dimensional accuracy vs clear version
• Improved water solubility is achieved with low light power printers, such as standard LCD printers
• Fast printability even with low power LCD printers
• Increased durability of the resin tank
• Metal- and organo-tin free formulation
• Clean and post-cure 3D prints with Cleaning Fluid WS1 Bio
• Level of printing difficulty: medium

Soluble materials may swell instead of dissolve in some printing settings, especially when they are cured at high relative power such as with high power laser and DLP printers.

Material performance depends on printer type, exposure conditions, mold geometry, dissolution conditions and full workflow implementation. Parameters must be validated by the user for each specific application.

• Water-soluble sacrificial mold material for low and medium temperature injection processes
• Balanced rigidity and resolution for thin-wall mold fabrication
• Fast solubility in water for efficient mold removal
• Very low shrinkage and high dimensional stability
• Compatible with low power and standard SLA/DLP/LCD printers

This material is supplied as a professional manufacturing material and is not marketed as a finished product. Final molding performance, dissolution behavior and process validation remain the responsibility of the user depending on printer, mold design and processing workflow.

For water-soluble sacrificial injection-molding material selection, compare adjacent grades according to the required temperature range and mechanical behaviour during the manufacturing workflow.

• Sacrificial & Mold-Making 3D Resins
• 3Dresyn IM-HDT-WS
• 3Dresyn IM-UHR-WS

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)