3Dresyn HTR-Silicone1 has these features and benefits:
- High Temperature Resistant Silicone above 200ºC
- UV & EB curable silicone soft and elastic photopolymer for nano and micro fabrication (photolithography and softlithography), such as printing of soft and elastic stamps for Nano Imprinting lithography NIL and for soft & elastic negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
- UV curable: excellent photoreactivity at 250-410 nm with medium energy dosage
- Electron beam EB curable
- compatible and blendable with our 3Dreyns for nano & micro fabrication
- 100% foldable without breaking
- synthetic resin source
- Shore Hardness A20-40 range
- medium tensile strength, <3 MPa
- medium soft and elastic (Young modulus <7 MPa)
- elongation at yield >100%
- refractive index 1.4-1.5
- durable, higher resistance than PDMS
- low viscosity <1000 mPas
- excellent balance of low viscosity for easy imprinting and low penetration
- very high resolution (printing resolution of less than 10 nm)
- very low shrinkage <0.1%
- printable by most commercial and professional SLA, DLP & LCD 3D printers
- organo-tin free
- high optical clarity
- high durability, non degradable as PDMS
- excellent bonding, low risk of debonding
- higher mechanical properties, with low risk of cracking vs PDMS
- imprint Temperature 160ºC or higher
- very low degassing at high vacuum
- low oxygen sensitivity
- high mechanical stability
- long shelf life of 1 year
- excellent spin coating application
- excellent etching with Reactive Ion Etching
- excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
- low penetration
- low surface tension with good release and demolding properties
- 100% organic (free of inorganic materials)
- contains hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
- no thermal treatment is required
- easy processing with standard lithography equipment
- easy removal of uncured resin with ketones, alcohols and esters
Applications
- UV curable molds for soft lithography
- LED lighting encapsulation
- power supplies
- sensors
- connectors
- transformers
- amplifiers
- industrial controls
- high voltage resistors
- relays
- adhesive/encapsulant for solar cells
- photocurable adhesive for integrated circuits during processing
- cost effective transparent stamp fabrication, alternative to quartz stamps
- ideal for mass sensors based on UV-NIL, ALD and RIE
Note: this resin exhibits similar temperature resistance to conventional high temperature resistant silicones. it is made to order and its delivery time is around 2-3 weeks after ordering.