Technical Bulletin PEEK-like 3D Resin — Ultra High Toughness and Flexural Strength 120–140 MPa

3Dresyn PEEK-like — Ultra-Tough Photopolymer Resin for SLA, DLP & LCD printing

Overview
3Dresyn PEEK-like is a high-performance, PEEK-inspired photopolymer engineered for functional parts that need very high flexural strength (120–140 MPa), high stiffness, impact resistance, and excellent chemical and thermal durability. Available in HV (higher mechanical performance) and LV (lower viscosity) versions for broad printer compatibility

Headline Mechanical & Thermal Performance

  • flexural strength (break): 120–140 MPa (HV)

  • Young’s modulus: 2.5–3.0 GPa

  • tensile strength: > 60 MPa

  • notched Izod impact: > 30 J/m

  • elongation at break: < 3 %

  • Shore D hardness: D85–90

  • HDT: > 120 °C @ 0.45 MPa; > 110 °C @ 1.8 MPa

  • density: 1.0–1.1 g/cm³
    (Values from product page; post-processing per IFU recommended.) 3Dresyns

Why it matters (context vs. PEEK & resins)

  • approaches unfilled PEEK flexural strength in the lab (typical unfilled PEEK: ~125–170 MPa depending on method/temperature), but prints on standard SLA/DLP/LCD equipment—no melt processing required

  • outperforms many engineering photopolymers positioned for strength (common flexural strength plateaus ~120–135 MPa). 3Dresyn PEEK-like’s HV version sits in the top tier of printable resins on flexural strength while maintaining high HDT and impact resistance

Chemical & Environmental Resistance

  • Hydrophobic with ultra-low water absorption (ULWA ≤ 32 µg/mm³); water solubility ≤ 1.6 µg/mm³

  • Very low uptake after 24 h in a broad set of solvents (e.g., NaOCl 5%, HCl 1 M, IPA, xylene all < 0.3–0.25 % gain)

  • Resistant to boiling water; autoclavable

Biocompatibility & Safety

  • Monomer-Free (MF) platform; metal and organotin-free

  • marketed as ultra-pure, non-cytotoxic; suitability for regulated uses must be customer-validated per application (ISO 10993, E/L, sterilization)

Recommended Applications

  • structural housings, jigs/fixtures, snap-fits with high stiffness

  • dental frames/denture bases requiring toughness + heat/chem resistance

  • under-hood or industrial environments with solvent/temperature exposure

  • thin-wall functional components, microfluidic manifolds, precision connectors 3Dresyns

Processing Notes

  • HV (~< 8000 cP @ 25 °C): highest strength/durability; prints even without heater if ambient > 20 °C.

  • LV (~< 6000 cP @ 25 °C): easier flow on unheated systems.

  • compatible with SLA, DLP & LCD printers; follow 3Dresyns IFU for exposure, wash, and post-cure to reach specs