3Dresyn PEEK-like is a high-performance, PEEK-inspired photopolymer engineered for functional parts requiring very high flexural strength (120–140 MPa), high stiffness, impact resistance, and excellent chemical and thermal durability. It is available in HV (higher mechanical performance) and LV (lower viscosity) versions for broad SLA, DLP & LCD printer compatibility.
Overview
3Dresyn PEEK-like targets demanding use cases where conventional photopolymers often plateau in mechanical resistance. The HV version is positioned for maximum strength and durability; the LV version supports easier flow on unheated systems.
Headline mechanical and thermal performance
| Property | Typical value | Notes |
|---|---|---|
| Flexural strength (break) | 120–140 MPa | HV version |
| Young’s modulus | 2.5–3.0 GPa | High stiffness |
| Tensile strength | > 40 MPa | Structural performance |
| Notched Izod impact | > 30 J/m | Impact resistance |
| Elongation at break | < 3% | Rigid, high-strength behavior |
| Shore D hardness | D85–90 | Hard, durable surface |
| HDT | > 120 °C @ 0.45 MPa; > 110 °C @ 1.8 MPa | Thermal durability |
| Density | 1.0–1.1 g/cm³ | Lightweight |
(Values from product page; post-processing per IFU recommended.)
Why it matters (context vs. PEEK and engineering resins)
- Approaches unfilled PEEK flexural strength in the lab (typical unfilled PEEK: ~125–170 MPa depending on method/temperature), while printing on standard SLA/DLP/LCD equipment (no melt processing required).
- Outperforms many “strong” engineering photopolymers in flexural strength, while maintaining high HDT and impact resistance.
Chemical and environmental resistance
- Hydrophobic with ultra-low water absorption (ULWA ≤ 32 µg/mm³); water solubility ≤ 1.6 µg/mm³.
- Very low uptake after 24 h exposure to a broad set of solvents (e.g., NaOCl 5%, HCl 1 M, IPA, xylene all < 0.3–0.25% gain).
- Resistant to boiling water; autoclavable.
Biocompatibility and safety
- Monomer-Free (MF) platform; metal and organotin-free.
- Marketed as ultra-pure and non-cytotoxic; suitability for regulated uses must be customer-validated per application (ISO 10993, E/L, sterilization).
Recommended applications
- Structural housings, jigs/fixtures, snap-fits requiring high stiffness
- Dental frames/denture bases requiring toughness plus heat/chemical resistance
- Industrial environments with solvent and temperature exposure
- Thin-wall functional components, microfluidic manifolds, precision connectors
Processing notes
- HV (~< 8000 cP @ 25 °C): highest strength/durability; can print without heater if ambient > 20 °C.
- LV (~< 6000 cP @ 25 °C): easier flow on unheated systems.
- Compatible with SLA, DLP & LCD printers; follow 3Dresyns IFU for exposure, wash, and post-cure to reach target specifications.