3Dresyn PSci PPO, for SLA, DLP & LCD printing of Plastic Scintillators for Radiation Detection

3Dresyn PSci PPO is our 3D resin for SLA, DLP & LCD printing of plastic scintillators for radiation detection.

PPO/POPOP-doped photopolymer resin engineered for SLA, DLP & LCD printing of plastic scintillators. Formulated on photopolymers containing PPO (primary fluor) and POPOP (secondary fluor / wavelength shifter) to enable fast, bright scintillation suitable for compact detectors, dosimetry phantoms, and education/research setups.

Designed for SLA, DLP & LCD printing of plastic scintillators for radiation detection in compact detectors, dosimetry phantoms, and education/research setups.

• Custom scintillator shapes
• Embedded light guides
• Micro-structured detector elements
• Teaching kits
• Shielding inserts with integrated sensing pathways

• Tensile strength: (ISO 527-1 / ISO 527-2)
• Flexural strength: (ISO 178)
• Young’s modulus: MPa (ISO 527)
• Elongation at break: (ISO 527)
• Shore hardness: ~75–85 (ISO 868)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Appearance (liquid): clear, pale yellow
• Viscosity: <2000 mPas at 23°C ± 2°C (ISO 3219)
• Cured color: very pale yellow to light amber
• Glass transition (Tg): ~70–90 °C (ISO 11357-2)

• Refractive index (nD): ~1.55–1.58 (ISO 489)

• Scintillating photopolymer (PPO/POPOP) tuned for 405 nm DLP/LCD printers
• Customizable light yield vs. printability via selectable PPO levels
• Efficient energy transfer to fluors
• Low-haze grades available
• Polishable to optical finish
• Fast organic scintillator response (PPO/POPOP)
• Relative yield increases with PPO loading

• PSci-S (Print-Ease): PPO 2–5 wt% — best printability/clarity; reference grade for process setup
• PSci-M (Balanced): PPO 6–10 wt% — higher light yield with moderate exposure increase
• PSci-H (High Yield): PPO 15–20 wt% — for thin parts or heated vat; requires longer exposures
• PSci-XH (Max Yield): PPO 25–30 wt% — experimental; heated vat (35–45 °C) strongly recommended, slow cure

• Couple to SiPM/PMT with an index-matching gel or optical epoxy
• Blacken non-coupling faces or use reflective wraps such as PTFE tape to manage escape cones
• For thick parts with high PPO, prefer short optical paths or internal light guides

• Designed for SLA, LCD & DLP printers with open parameters
• Works on most SLA, DLP & LCD printers with adjustable exposure
• Resin temperature: 25 °C for PSci-S/M; 35–40 °C recommended for PSci-H/XH
• Build plate / first layers: increase base exposure ×3–5 vs. normal layers
• Normal layer exposure: higher than standard clear 3D resins
• Layer thickness: 50–100 µm typical; thinner layers aid through-cure at high PPO
• Wash: quick two-step rinse in a low-extractable, low-fluorescence cleaner; avoid over-washing to limit dopant leaching
• Dry: filtered air or cleanroom wipes; no prolonged soak in cleaning fluid
• Post-cure: 405–420 nm, optionally add 365 nm, to maximum conversion
• Finishing: progressive micro-polish and/or optical clearcoat to maximize internal reflection; keep surfaces clean before coupling

• Does not contain flammable raw materials
• Guaranteed shelf life: 12 months
• Delivery time: around 3–4 weeks after ordering

Higher PPO improves scintillation yield but increases optical absorption at 405 nm, narrowing the print window. Choose the variant that best matches your printing specifications. Absolute light yield and timing depend on geometry, surface finish, and detector coupling.

This material is supplied as a professional manufacturing material for radiation detection and related technical applications. Final part performance and suitability must be validated by the user according to the intended detector design, processing conditions and end-use requirements.

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)