3Dresyn 2PP F1, Flexible photopolymer for two photon polymerization

3Dresyn 2PP F1 Bio is a flexible photopolymer for two photon polymerization.

It is designed as a negative photoresist for slow-medium writing speed additive manufacturing of flexible 3D nano and microstructures, offering an excellent balance of resolution and writing speed.

Designed for two photon polymerization workflows, including Dip-in two-photon lithography DTPL / Dip-in Laser Lithography DiLL and conventional Two Photon Lithography TPL configurations, for fabrication of flexible 3D nano and microstructures.

• Slow-medium writing speed additive manufacturing of flexible 3D nano and microstructures
• Dip-in two-photon lithography DTPL / Dip-in Laser Lithography DiLL
• Conventional two photon polymerization systems / Two Photon Lithography TPL

• Tensile strength: <5 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <5 MPa (ISO 178)
• Young’s modulus: <50 MPa (ISO 527)
• Elongation at break: >100% (ISO 527)
• Shore hardness: A50 (ISO 868)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Printing shrinkage: no measurable dimensional shrinkage after calibration under validated processing conditions
• Optical transparency: 100% from 440 nm onwards into the Near Infrared NIR
• Viscosity: <15 mPas at 23°C ± 2°C (ISO 3219)
• Achievable feature sizes: 100-200 nm

• Ideal 2PP photocurable resin negative photoresist for slow-medium writing speed additive manufacturing of flexible 3D nano & microstructures
• Excellent balance of resolution shape accuracy and writing speed
• Photoreactive from 200 to 410 nm with Fine Tuner 2PP FT8 Bio (single 1 photon absorption)
• Photoreactive from 600 to 810 nm with Fine Tuner 2PP FT8 Bio (two photon absorption)
• Flexible
• Excellent adhesion on glass and other substrates
• Clear
• Biocompatible

• Designed for Dip-in two-photon lithography DTPL also referred as Dip-in Laser Lithography DiLL where the 2PP resin is immersed upside down in the microscope objective
• Designed for conventional 2PP systems also refered as Two Photon Lithography TPL where the 2PP resin is positioned upright on the substrate
• Easy handling by direct drop casting
• Printable by most commercial two photon polymerization printers with wavelengths from 600 nm to 800 nm
• Supplied at different writing speeds: fast, intermediate, slow, and non reactive for custom control of writing speed and resolution
• Tunable with the free sampled Fine Tuner 2PP FT8 Bio for custom adjustment of writing speed
• Tunable with the free sampled Fine Tuner 2PP LB3 Bio for maximum resolution with submicron feature sizes
• Supplied in a relatively low viscosity version (<15 mPas) for easy development or cleaning of uncured resin with conventional 2PP upright configurations
• Easy removal of uncured resin with conventional developers such as isopropanol IPA and propylene glycol methyl ether acetate (PGMEA)
• Ideally use our biocompatible Cleaning Fluid UNW1 Bio to preserve transparency, prevent whitening and chemical attack of IPA and conventional alcohols

• Organo-tin free

Final writing speed, resolution, feature size, adhesion, printability, transparency and cleaning performance depend on the printer configuration, wavelength, substrate, developer and full processing workflow. Performance must be validated by the user for each specific application.

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.

• 2PP resins for two photon polymerization of nano & microstructures

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)