Dynamic Additives for Repairable, Stress-Managed 3D Resins

3Dresyns Dynamic Additives for Repairable, Stress-Managed 3D Resins:

• 3D-ADD Self-Heal (SH Series) — Temperature-Targeted Repair Additives

• 3D-ADD ReBond Weld — Stress-Relief During Cure, Interlayer Welding & Post-Print Self-Repair

Quick Selection — Which additive fits your job?

SH Series — Activation guide (typical)

Note: Exact time/temperature depend on matrix Tg, post-cure level, section thickness, and applied pressure—validate on internal coupons

1) Executive Summary

3D-ADD SH Series and ReBond Weld are drop-in, dynamic covalent additives designed for SLA/DLP/LCD resins (385–405 nm). Both improve cure-stress control, z-cohesion, and post-print reparability, but they are optimized for different activation profiles and adoption scenarios:

• 3D-ADD SH Series (SH-RT / SH-60 / SH-80 / SH-100 / SH-120): choose the activation temperature that matches your part and process; ideal when a target repair temperature is required (from room-temperature assist to ~120 °C).

• 3D-ADD ReBond Weld: universal “plug-and-play” additive for fast adoption and clean handling; excellent interlayer welding and stress-relief with minimal changes to existing workflows.

Use them separately or together (e.g., ReBond Weld for baseline stability + SH-XX to hit a specific repair window).

2) What Problems They Solve

• Cure-Stress & Warpage: moderates exotherm/shrinkage, cutting distortion and micro-cracking in rigid acrylates.
• Weak Z-Direction: enables interlayer re-bonding (“welding”) after print/post-cure to raise z-cohesion.
• Field Repair / Longevity: closes craze lines, edge chips, and interface defects to extend part life.

• Yield & Rework: saves borderline parts and assemblies without reprinting.

3) Product Positioning & Differences

3D-ADD Self-Heal (SH Series) — Temperature-Targeted

Grades & intent:

• SH-RT — Room-temp assist / light-assist; soft parts & delicate components.

• SH-60 — ≈60 °C; optical & delicate functional parts.

• SH-80 — ≈80 °C; general-purpose.

• SH-100 — ≈100 °C; engineering resins, higher-Tg matrices.

• SH-120 — ≈120 °C; high-performance, demanding use.

When to choose: You need a defined repair protocol at a specific temperature that matches your part’s Tg/service limits or maintenance SOPs.

Core benefits: predictable activation window, high clarity retention at recommended use levels, scalable from lab to production with consistent procedures.

3D-ADD ReBond Weld — Universal, Plug-and-Play

When to choose: You want immediate stability improvements and simple interlayer welding with minimal formulation changes.

Core benefits: broad compatibility, low odor, low volatility, strong z-bond recovery, and fast onboarding for existing acrylate/methacrylate platforms.

4) Side-by-Side Comparison

5) Recommended Applications

• SH-RT: thin optics, flexible lattices, soft seals, thin-wall parts; bench-side, light-assisted repairs at room temperature
• SH-60: lenses/lightguides, microfluidics, delicate housings where low-temperature protocols protect geometry/finish
• SH-80: general jigs/fixtures, consumer prototypes, functional covers—balanced repair speed vs. heat exposure
• SH-100: rigid engineering parts (UDMA/IBMA-rich), parts exposed to moderate service temperatures; fast z-bond recovery
• SH-120: high-Tg, highly crosslinked systems; demanding components needing robust crack-closure

ReBond Weld (all-rounder): default upgrade for dimensional stability, z-cohesion, and repairability across clear and pigmented acrylate/methacrylate resins.

6) How to Implement

Incorporation (both products)

• Add directly to the host resin under moderate stirring.

• If needed, temper to 40–50 °C for fast homogenization; degas (vacuum or N₂ purge).

• Expect a modest exposure increase vs. baseline; re-optimize initial and per-layer times.

• Post-cure: follow the host resin’s standard UV post-cure.

Activation Protocols

• SH Series: follow the grade’s activation window (RT / 60 / 80 / 100 / 120 °C) for 10–30 min with light pressure. SH-RT can use local light-assist at room temperature.

• ReBond Weld: thermal protocol in the 70–110 °C range depending on matrix/post-cure; optional light-assisted welding for local joints.

Final time/temperature depend on matrix Tg, post-cure level, section thickness, and applied pressure—validate on internal coupons.

7) Process & Design Tips

• Design for repair: keep joint faces accessible; plan small jigs/fixtures for pressure during re-bonding.

• Minimize oxygen in mixing: degas; nitrogen blanket prolongs pot life and batch-to-batch consistency.

• Exposure tuning: increase base/initial layer exposure 10–20 % as a starting point; refine per geometry.

• Color-critical parts: verify transmission/yellowness index at the intended dose and post-cure schedule.

8) Compatibility & Scope

• Platforms: 3Dresyns 3D resins resins

• Wavelengths: 385–405 nm photoinitiator systems.

• Formulations: clear and pigmented; validate with very high filler loads or heavy opacity.

9) Safety, Storage, and Packaging

• PPE: gloves, goggles, lab coat; ensure ventilation. Avoid prolonged intense light during handling.

• Storage: 15–25 °C, dry, protected from light; nitrogen headspace recommended for repeated openings.

• Shelf life: 12 months sealed.

• Packaging: 1 kg and 5 kg standard; larger formats on request.

10) Selection Guide (Quick)

• Need a defined repair temperature? → SH Series (pick SH-RT / 60 / 80 / 100 / 120).

• Want immediate, broad improvements with minimal change? → ReBond Weld.

• Mission-critical optics or delicate parts? → SH-RT or SH-60.

• Rigid engineering parts / higher Tg? → SH-100 or SH-120 (or pair with ReBond Weld).

• General stability & z-bond in many SKUs? → ReBond Weld as the baseline additive.

11) Optional Add-On

• 3D-ADD SHB1 Self-Heal Booster (free evaluation vial with SH orders) — helps accelerate re-bonding or lower activation temperature during trials. Start at 0.05–0.20 wt% in the host resin; A/B test with and without.